TPS series CMP slurry, colloidal silica as mainly abrasive, have the advantages of uniform particle size, good dispersity, fast polishing speed and good surface quality, which can meet the requirements in industry of Ultra-precision finishing for various material surfaces.
Nowadays, it has been widely used in surface thined and polished of sapphire, ceramics, metal and silica wafer, etc.
Mixing with water according to different production technology is available.